Possible investment in Gwangju could place Samsung in a stronger position in the race for advanced chips used in AI
Samsung Electronics is considering building a new advanced chip packaging factory in Gwangju, in the southwest of South Korea, according to information released by the Korea Economic Daily on Tuesday, June 9, 2026. The possible investment comes amid the global race for more powerful semiconductors, especially those used in artificial intelligence, HBM memories, and high-performance servers. The structure has not yet been officially confirmed, but it already indicates an attempt by the company to strengthen its presence in an increasingly strategic stage of the chip chain.
Plan may be presented in meeting with the South Korean government
The proposal could be presented on June 29, 2026, during a meeting at the presidential office of South Korea. The meeting is expected to gather President Lee Jae Myung, the president of Samsung Electronics, Jay Y. Lee, and the president of SK Group, Chey Tae-won. According to the Korea Economic Daily, the meeting will address a major shift in the country’s growth strategy, which increases the political and economic weight of the possible announcement. The presence of large conglomerates reinforces the relevance of the semiconductor sector to the South Korean economy.
Advanced packaging gains importance with AI chips
Advanced semiconductor packaging has taken on a more important role in the global chip industry. This technology allows integrating multiple units into a single package, improving performance and efficiency in high-demand applications. The advancement of artificial intelligence has further increased this need, as servers and accelerators depend on components capable of processing large volumes of data quickly. In this scenario, HBM memory has gained prominence for stacking DRAM chips vertically and offering high bandwidth.
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HBM dispute pressures Samsung and competitors
Samsung attempts to expand its share in the HBM market, an area considered essential for chips used by companies like Nvidia, AMD, and Google. The company also seeks to challenge SK Hynix, the current leader in this segment. In May 2026, Samsung announced that it began sending samples of the 12-layer HBM4E to customers, a move that signals technological acceleration in an increasingly competitive market. The demand for artificial intelligence has made this competition even more relevant for global memory manufacturers.
New factory could strengthen advanced chip supply chain
The possible installation in Gwangju would reinforce Samsung’s capacity in advanced packaging, a stage considered critical for the final performance of semiconductors. The investment could also expand the company’s structure at a time of growing demand for data centers, generative AI, and high-performance computing. The movement, according to market analysis, would indicate preparation for a possible upturn in the chip cycle driven by demand for artificial intelligence.
Samsung has not yet confirmed construction
Samsung Electronics refused to comment on the information published by Korea Economic Daily. The South Korean presidential office also stated that corporate investment decisions should be defined by the companies themselves. Thus, the project remains an internal evaluation, without official confirmation of construction, investment value, or implementation schedule.
What changes in the global race for chips
The possible advanced packaging factory could strengthen Samsung in one of the most contested areas of the semiconductor industry. The demand for AI, HBM memories, and high-performance chips pressures manufacturers to expand technology, production capacity, and delivery speed. The bet in Gwangju, if it advances, could help the company compete more strongly in a market dominated by innovation, scale, and relationships with major global clients.
Do you believe that Samsung will be able to close the gap with SK Hynix in the HBM memory market used in artificial intelligence?

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